3rd International Conference on Electrical & Computer Engineering (E&C 2018)


August 25 ~ 26, 2018, Dubai, UAE

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Scope

3rd International Conference on Electrical & Computer Engineering (E&C 2018) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications impacts and challenges of Electrical & Computer Engineering. The conference documents practical and theoretical results which make a fundamental contribution for the development of Electrical & Computer Engineering. The aim of the conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.

Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to.

Important Dates


Submission Deadline

July 22, 2018

Authors Notification

August 08, 2018

Registration & Camera-Ready Paper Due

August 15, 2018


Topics of Interest


  • Communications and Networks
  • Control, Intelligent Systems and Robotics
  • Integrated Circuits and Embedded Systems
  • Microelectronic Technologies, Devices, CAD and, VLSI
  • Microwave, Nano Devices and RF
  • Power and Energy Systems
  • Signal Processing and New Media
  • Applied ElectroMagnetics
  • Artificial Intelligence and Artificial Life
  • Hardware Formal Verification
  • Photonics
  • Software Engineering and Real-time Systems



Paper Submission

Authors are invited to submit papers through the Conference Submission System by July 22, 2018 Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published as a Special Issue in Electrical & Computer Engineering: An International Journal (ECIJ) series (Confirmed).








Event Sponsors


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Proceedings

Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on


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